Ap Microelectronics LLC

Overview

New F&S Bondtec Manual and Automatic Wire Bonders and Pull Testers. Used Mech-El/Marpet Wire Bonders and Die Mounters. Royce Waffle Pack Loaders, Dage Pull Testers, Microscopes and more. Equipment Repair, Process Development & Training.

Classification

This U.S. industry comprises establishments primarily engaged in manufacturing wafer processing equipment, semiconductor assembly and packaging equipment, and other semiconductor making machinery.

1. Manufacturing33
2. Machinery Manufacturing333
3. Industrial Machinery Manufacturing33324
4. Semiconductor Machinery Manufacturing333242

Federal awards