Ftg Circuits Haverhill Inc.

Overview

Capabilities are very application specific -- however we typically can: Produce up to 20 layers on materials as thin as one mil and as thick as .125 Routinely handle lines and traces as tight as .003 with drilled hole sizes as small as .007 Blind and Burried vias, sequential lamination even with mixed construction. Laminate and plate virtually any material including:

Classification

This U.S. industry comprises establishments primarily engaged in manufacturing bare (i.e., rigid or flexible) printed circuit boards without mounted electronic components. These establishments print, perforate, plate, screen, etch, or photoprint interconnecting pathways for electric current on laminates.

1. Manufacturing33
2. Computer and Electronic Product Manufacturing334
3. Semiconductor and Other Electronic Component Manufacturing33441
4. Bare Printed Circuit Board Manufacturing334412