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Hybond Inc

Unclaimed

Semiconductor Machinery ManufacturingEscondido, CA

Founded

1981

Primary NAICS

333242

CAGE code

3VUF1

Federal awards

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Overview

HYBOND designs and manufactures thermosonic wire bonders, peg bonders, epoxy and eutectic die bonders, and heated work stages.

Classification

This U.S. industry comprises establishments primarily engaged in manufacturing wafer processing equipment, semiconductor assembly and packaging equipment, and other semiconductor making machinery.

  1. Manufacturing33
  2. Machinery Manufacturing333
  3. Industrial Machinery Manufacturing33324
  4. Semiconductor Machinery Manufacturing333242

Capabilities

Commercial and Industrial Machinery and Equipment (except Automotive and Electronic) Repair and MaintenanceSpecialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery

Location