Mrsi Systems, LLC

Overview

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

Classification

This U.S. industry comprises establishments primarily engaged in manufacturing wafer processing equipment, semiconductor assembly and packaging equipment, and other semiconductor making machinery.

1. Manufacturing33
2. Machinery Manufacturing333
3. Industrial Machinery Manufacturing33324
4. Semiconductor Machinery Manufacturing333242