
Pac Tech USA Packaging Technologies, Inc
UnclaimedSemiconductor and Related Device ManufacturingSanta Clara, CA
Founded
2001
Primary NAICS
334413
CAGE code
5X0L6
Federal awards
$21.9K
Overview
Leading supplier of Advanced Packaging Equipment and Wafer Level Bumping and Packaging Services with customers around the globe.
Classification
This U.S. industry comprises establishments primarily engaged in manufacturing semiconductors and related solid-state devices. Examples of products made by these establishments are integrated circuits, memory chips, microprocessors, diodes, transistors, solar cells, and other optoelectronic devices.
- Manufacturing33
- Computer and Electronic Product Manufacturing334
- Semiconductor and Other Electronic Component Manufacturing33441
- Semiconductor and Related Device Manufacturing334413
Federal awards
| Year | Agency | Obligated | Actions |
|---|---|---|---|
| 2024 | Department of Justice | $13,882 | 1 |
| 2023 | Department of Justice | $8,000 | 1 |